Good things come in small packages: uOMIC by TNFG Supported by CDTI Funds

The UOMIC project comes alive and is now released. Long time developing this small but big project, Developed in Paterna, Valencia in our facilities by our engineers, UOmic funded  CDTI with a budget of 694.781€ is real and is alive. uOMIC is a complete power management IC that can power the an entire system from [...]

By |2019-07-19T12:59:45+00:00July 16th, 2019|Categories: General|0 Comments

Smart home devices created easily with modular hardware

Since the introduction of the first home appliances in the early 20th century, the smart home market has been steadily growing with revenue set to reach USD$61.3 million in the USA alone by the end of this year. With the introduction of secure wireless connectivity and IoT technology the automation of home devices and other [...]

By |2018-04-24T11:15:23+00:00April 24th, 2018|Categories: General|0 Comments

Processor News: Qualcomm Snapdragon goes Modular

The Qualcomm Snapdragon 410E processor is now available as a certified core module that can be used with your motherboard. It has been developed with IoT and embedded computing in mind, with a particular focus on smart homes, building automation, industrial control, digital signalling and smart surveillance devices. This core module integrates increasingly [...]

By |2018-04-16T11:38:01+00:00April 16th, 2018|Categories: General|0 Comments

How hardware works is a manufacturing system of hardware and software developed by Tecnofingers S.L. The system increases the productiveness of development teams when creating or updating electronic devices so companies can get them out to market fast. The hardware system works by increasing the number of concepts developers can trial during the prototyping and testing [...]

By |2018-04-06T13:26:03+00:00April 6th, 2018|Categories: General|0 Comments

Build and upgrade your hardware quickly and easily with

Upgrading the hardware of a product has been an inflexible, time consuming and wasteful process. Once a component is incorporated into the circuitry of a PCB there was no way to remove it or swap it out without throwing it away and beginning again. This has changed with the manufacturing system, which has changed [...]

By |2018-03-27T10:34:03+00:00March 26th, 2018|Categories: General|0 Comments

Embedded World 2018: The motherboard of all fairs

Embedded Fair Report We had just finished packing but the thrill of the fair still remained. Embedded World 2018 was over and the truck with our booth was now backing away. Embedded World, an electrical systems trade fair, located in Nuremberg, Germany, brought together developers from all industries and was the perfect event to showcase [...]

By |2018-03-20T12:03:48+00:00March 16th, 2018|Categories: General|0 Comments

Packed and ready to go: Embedded World 2018

Here We Come Embedded World We are excited to be attending this year's Embedded World 2018 in Nuremberg, Germany. The Fair runs from the 27th February - 1st March 2018 and invite you to come! The fair is the engine of the IoT, e-mobility, energy efficiency industries and the best place to find the latest in [...]

By |2018-02-20T14:52:53+00:00February 7th, 2018|Categories: General,|Tags: |0 Comments S300 Master Module S7G2 for IoT Developers

The S300 Socket is designed to bring all the possibilities of a high-end processor to IoT developers. Up to 300 Signals with different buses like SPI, I2C, UART, SDIO, QSPI, PWM, ADC, GPIO and more. This module can be used with all PCB Class 2 and Class 3 boards with S100/S200 and S300 High Performance [...]

By |2018-02-20T15:14:54+00:00November 14th, 2017|Categories: General|0 Comments’s S400 Motherboard compatible with the Qualcomm Snapdragon 410e Core processor presents the Snapdragon 410E core processor with S400 Socket. a high performance processor that is perfectly compatble with our line of modular PCB Motherboard Class 1s . Designed to meet the demanding requirements of embedded computing, specifically relating to high performance, energy efficiency, multimedia features, integrated connectivity and long-term support, the Qualcomm Snapdragon 410E [...]

By |2018-02-21T18:50:37+00:00November 2nd, 2017|Categories: General|0 Comments DRAM the Smallest DDRAM Module

The New Core Generation Comes with a new Family in Rhomb. I Ecosystem, the DRAM Module, following the requirements of system. We have designed under Jedec Specifictaions, the DRAM Module DDR4, to meet the needs with small devices. 60% less space than standard SO-DIM modules, less power consumption, mechanical connectivity up to 50GBPS, fast [...]

By |2017-11-02T15:29:07+00:00October 31st, 2017|Categories: General|0 Comments